Semi-rigid, general purpose, cold curable potting system with very good dielectrical properties.
Micares® 730 R11 is a casting resin system based on polyurethane, consisting of resin and hardener. This two component potting compound, designed for use in the electrical engineering and the electronics is cold and thermal-curing. Micares® 730 R11 is solvent-free and liquid at ambient temperature. The resin contains the filler and is already degassed.
| - Mix ratio: | 5 : 1 (by weight) |
| - Mix viscosity*: | 1.5 - 2.5 Pas (25 °C) |
| - Mix density*: | 1.60 g/cm3 |
| - Tg*: | 30 - 38 °C |
| - Shore D*: | 75 |
| - Loss factor*: | 0.03 |
| - Dielectrical strength*: | 18 - 20 kV/mm (on 2 mm plates) |
| - Thermal Class*: | B |
| - Thermal conductivity*: | 0.50 - 0.65 W/°Km |
* Typical values (not specifications)
Gel time and colour can be adjusted to customer needs.
For further details see data sheet ( Downloads)