Rigid, heat curable casting system with very good dielectrical properties also at elevated temperature.
Micares® 721 R1 is a casting resin system based on polyurethane, consisting of resin and hardener. This two component potting compound, designed for use in the electrotechnics and the electronics, is thermal-curing, solventfree and liquid at ambient temperature (RT). The resin component contains the filler and is pre - evacuated.
| - Mix ratio: | 2.5 : 1 (by weight) |
| - Mix viscosity*: | 1.2 - 2.2 Pas (25 °C) |
| - Mix density*: | 1.5 - 1.6 g/cm3 |
| - Tg*: | 95 - 110 °C |
| - Shore D*: | 88 |
| - Loss factor*: | 0.04 |
| - Dielectrical strength*: | 20 - 24 kV/mm (on 2 mm plates) |
| - Thermal Class*: | B |
| - Thermal conductivity*: | 0.45 - 0.55 W/°Km |
* Typical values (not specifications)
Gel time and colour can be adjusted to customer needs.
For further details see data sheet ( Downloads)