Soft, elastomeric, cold curable potting system with excellent dielectrical properties; thermal class B
Micares
® 730-9051 is a casting resin system based on polyurethane, consisting of resin and hardener. This two component potting compound designed for use in the electrical engineering and the electronics is cold to thermal-curing. It is solvent free and liquid at ambient temperature (RT). The resin component contains the filler and is degassed.
| - Mix ratio: | 9 : 1 (by weight) |
| - Mix viscosity*: | 2.8 - 4.2 Pas (25 °C) |
| - Mix density*: | 1.35 - 1.40 g/cm3 |
| - Tg*: | < -50 °C |
| - Shore A*: | 50 |
| - Loss factor*: | 0.01 |
| - Dielectrical strength*: | 23 kV/mm (on 2 mm plates) |
| - Thermal Class*: | B |
| - Thermal conductivity*: | 0.40 W/°Km |
* Typical values (not specifications)
Gel time and colour can be adjusted to customer needs.
For further details see data sheet ( Downloads)